Ａ

Temperature correction is enabled by mounting a temperature sensor on the sensor substrate.

Ｂ

Design flexibility is improved by separating the sensing parts and mounting parts.

Ｃ

Space-saving and low cost are achieved by mounting multiple sensors on one substrate.

Ｄ

The heat conductivity of the substrate is increased by using a ceramic substrate as the sensor substrate.

Ｅ

The sensing part is made thinner by using a flexible substrate as the sensor substrate.

Ｆ

Space-saving and low cost are achieved by mounting multiple sensors on one substrate.

Ｇ

IC substrate for evaluating coils

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